Title:
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/133527
Kind Code:
A1
Abstract:
This semiconductor device includes a semiconductor chip, an electroconductive member for supporting the semiconductor chip, a bonding material provided between the electroconductive member and the semiconductor chip, and a release groove arranged away from the semiconductor chip and having both ends formed on the outer surface of the electroconductive member so as to join the peripheral ends of the electroconductive member.
Inventors:
HAYASHI KENJI (JP)
SUZAKI AKIHIRO (JP)
SUZAKI AKIHIRO (JP)
Application Number:
PCT/JP2015/056375
Publication Date:
September 11, 2015
Filing Date:
March 04, 2015
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L21/52; H01L23/29; H01L25/07; H01L25/18
Domestic Patent References:
| WO2013168796A1 | 2013-11-14 |
Foreign References:
| JP2013175551A | 2013-09-05 | |||
| JP2000252403A | 2000-09-14 | |||
| US5701034A | 1997-12-23 | |||
| JP2005217072A | 2005-08-11 | |||
| JP2010098153A | 2010-04-30 |
Other References:
See also references of EP 3116020A4
Attorney, Agent or Firm:
INAOKA, Kosaku et al. (JP)
Kosaku Inaoka (JP)
Kosaku Inaoka (JP)
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