Title:
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/218959
Kind Code:
A1
Abstract:
This semiconductor device comprises a semiconductor element, a sealing resin that covers the semiconductor element, a terminal that conducts electricity to the semiconductor element and protrudes from the sealing resin in a first direction that is orthogonal to the thickness direction, and a plating layer that is disposed on the terminal. The terminal is provided with: a distal-end surface, which is an end surface located on the side protruding from the sealing resin; a first surface that faces a first thickness-direction side; and a recess that is recessed from both the distal-end surface and the first surface. The plating layer includes a recess plating section disposed on at least part of the recess.
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Inventors:
MATSUBARA HIROAKI (JP)
Application Number:
PCT/JP2023/016432
Publication Date:
November 16, 2023
Filing Date:
April 26, 2023
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L23/50
Domestic Patent References:
| WO2006109566A1 | 2006-10-19 |
Foreign References:
| JPH04134852A | 1992-05-08 | |||
| JP2005209999A | 2005-08-04 | |||
| JP2016051734A | 2016-04-11 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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