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Title:
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2018/088080
Kind Code:
A1
Abstract:
This semiconductor device is provided with: a lead (2) which has one surface (21), the other surface (22) that is on the reverse side of the one surface (21), and a lateral surface (23) that connects the one surface (21) and the other surface (22) to each other; a sealing body which is integrated with the lead (2) by means of a resin; and a resin burr (4) which is composed of a part of the resin and adheres to the lead (2), while protruding from the sealing body. A peel-off prevention part (25) which prevents the resin burr (4) from peeling off from the lead (2) by enhancing the adhesion between the lead (2) and the resin burr (4) is formed at a corner part (24) between the one surface (21) and the lateral surface (23).

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Inventors:
KUSAMA HIROTOSHI (JP)
NOMURA TAKUMI (JP)
Application Number:
PCT/JP2017/036353
Publication Date:
May 17, 2018
Filing Date:
October 05, 2017
Export Citation:
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Assignee:
DENSO CORP (JP)
International Classes:
H01L23/50
Foreign References:
JP2014007269A2014-01-16
JP2009267398A2009-11-12
JP2006140265A2006-06-01
Attorney, Agent or Firm:
YOU-I PATENT FIRM (JP)
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