Title:
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/054389
Kind Code:
A1
Abstract:
A semiconductor device according to the present invention is provided with: a semiconductor element which has an element front surface, an element back surface that is on the reverse side of the element front surface, and an element lateral surface that connects the element front surface and the element back surface to each other; a conductive part that is arranged in a position where the conductive part faces the element back surface, and has a wiring part on which the semiconductor element is mounted; and a sealing resin which seals the semiconductor element and the conductive part. The wiring part has a wiring front surface that faces the element back surface, and a wiring back surface that is on the reverse side of the wiring front surface. The conductive part has a terminal part which extends from the wiring back surface in a direction that is opposite to the semiconductor element. The sealing resin covers the element back surface, the element lateral surface and the wiring front surface. The element front surface is exposed without being covered by the sealing resin.
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Inventors:
SANO NAOYUKI (JP)
SHINKAI HIROYUKI (JP)
SHINKAI HIROYUKI (JP)
Application Number:
PCT/JP2022/036006
Publication Date:
April 06, 2023
Filing Date:
September 27, 2022
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L23/12; H01L21/304; H01L23/28; H01L23/29
Foreign References:
| JP2020027850A | 2020-02-20 | |||
| JP2021086848A | 2021-06-03 | |||
| JP2002184913A | 2002-06-28 |
Attorney, Agent or Firm:
ONDA Makoto et al. (JP)
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