Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2010/106732
Kind Code:
A1
Abstract:
Provided is a semiconductor device (6) having semiconductor chips laminated therein, wherein a second semiconductor chip (2) is laminated on a first semiconductor chip (1) with an adhesive layer (3) therebetween, and the chips are packaged by means of a resin (5) containing a filler (4) or the like. The first semiconductor chip (1) is composed of a first region (11) having the second semiconductor chip (2) laminated on the surface, and a second region (12) having no second semiconductor chip (2) laminated on the surface. On the wiring layer, including the topmost layer, there is no wiring pattern extending over the first region (11) and the second region (12).
Inventors:
MIYOSHI ASAKO
CHAYA SHIGEO
CHAYA SHIGEO
Application Number:
PCT/JP2010/001009
Publication Date:
September 23, 2010
Filing Date:
February 17, 2010
Export Citation:
Assignee:
PANASONIC CORP (JP)
MIYOSHI ASAKO
CHAYA SHIGEO
MIYOSHI ASAKO
CHAYA SHIGEO
International Classes:
H01L25/065; H01L25/07; H01L25/18
Foreign References:
| JP2005158768A | 2005-06-16 | |||
| JP2003229533A | 2003-08-15 | |||
| JP2006210745A | 2006-08-10 |
Attorney, Agent or Firm:
MAEDA, Hiroshi et al. (JP)
Hiroshi Maeda (JP)
Hiroshi Maeda (JP)
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