Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/079970
Kind Code:
A1
Abstract:
Provided is a semiconductor device comprising: a first metal body (41); a second metal body (42) which is positioned facing the first metal body; a first semiconductor chip (51) which is positioned in the facing region and which comprises a Si substrate and a first element formed thereon, and a second semiconductor chip (52) which is positioned in the facing region and which comprises a SiC substrate and a second element formed thereon; and a first terminal (61) interposed between the second metal body and the first semiconductor chip and a second terminal (62) interposed between the second metal body and the second semiconductor chip. In a perpendicular direction to the facing direction, a coefficient of linear expansion of the second terminal is less than a coefficient of linear expansion of the first terminal. With a first sum total taken to be the sum total of the products of the thicknesses of the members and the coefficient of linear expansion in the facing direction in terms of a first virtual line which is parallel to the facing direction and which traverses a region overlapping with the first terminal in a projection view in the facing direction, and with a second sum total taken to be the sum total of the products of the thicknesses of the members and the coefficient of linear expansion in the facing direction in terms of a second virtual line which is parallel to the facing direction and which traverses a region overlapping with the second terminal, the second sum total is greater than or equal to the first sum total.
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Inventors:
KATO NOBUYUKI (JP)
ISHINO HIROSHI (JP)
AKIYAMA HIRONORI (JP)
ISHINO HIROSHI (JP)
AKIYAMA HIRONORI (JP)
Application Number:
PCT/JP2019/034327
Publication Date:
April 23, 2020
Filing Date:
September 02, 2019
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
H01L25/07; H01L25/18
Domestic Patent References:
| WO2018020695A1 | 2018-02-01 |
Foreign References:
| JP2016219532A | 2016-12-22 | |||
| JP2009272482A | 2009-11-19 | |||
| JP2018116994A | 2018-07-26 | |||
| JP2018074089A | 2018-05-10 | |||
| JP2004356625A | 2004-12-16 |
Attorney, Agent or Firm:
JIN Shunji (JP)
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