Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/018729
Kind Code:
A1
Abstract:
This semiconductor device is provided with: an electronic component and a substrate, which are arranged so as to face each other in a first direction; and a solder which connects the electronic component and the substrate to each other. The electronic component is provided with a first electrode on a surface that faces the substrate; the substrate is provided with a second electrode on a surface that faces the electronic component; the solder has a bonding part, which is formed of an intermetallic compound, at respective interfaces with the electronic component and the substrate; the solder is mainly composed of Sn; and the thickness variation of the bonding part in the first direction is less than 2 micrometers.
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Inventors:
KATO MASAKO (JP)
IKEDA OSAMU (JP)
YAMASHITA SHIRO (JP)
IKEDA OSAMU (JP)
YAMASHITA SHIRO (JP)
Application Number:
PCT/JP2023/017620
Publication Date:
January 25, 2024
Filing Date:
May 10, 2023
Export Citation:
Assignee:
HITACHI ASTEMO LTD (JP)
International Classes:
H01L21/60; B23K35/26; C22C13/00; C22C13/02
Foreign References:
| JP2011041979A | 2011-03-03 | |||
| JP2016047555A | 2016-04-07 | |||
| JP2005254298A | 2005-09-22 |
Attorney, Agent or Firm:
SUNNEXT INTERNATIONAL PATENT OFFICE (JP)
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