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Title:
SEMICONDUCTOR ENCAPSULATING METHOD AND SEMICONDUCTOR ENCAPSULATING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2022/206749
Kind Code:
A1
Abstract:
The present application provides a semiconductor encapsulating method and a semiconductor encapsulating structure. The semiconductor encapsulating method comprises: forming a first encapsulation structure (101) and a second encapsulation structure (201); mounting the first encapsulation structure (101) and the second encapsulation structure (201) on a third carrier plate (30); forming a third encapsulation layer (33) to obtain a third encapsulation structure (301); stripping the third carrier plate (30); forming a through hole penetrating through the third encapsulation structure (301), forming a conductive structure (60) in the through hole, arranging a third rewiring structure (40) on a first surface (311) of the third encapsulation structure (301), and arranging a fourth rewiring structure on a second surface (312) of the third encapsulation structure (301); enabling the third rewiring structure (40) to be electrically connected to the fourth rewiring structure by means of the conductive structure (60), and enabling the third rewiring structure (40) to be electrically connected to a first rewiring structure (17) of the first encapsulation structure (101) and a second rewiring structure (22) of the second encapsulation structure (201), respectively; and arranging a passive member (90) on the side of the fourth rewiring structure facing away from the second surface (312).

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Inventors:
CHEW JIMMY (CN)
Application Number:
PCT/CN2022/083632
Publication Date:
October 06, 2022
Filing Date:
March 29, 2022
Export Citation:
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Assignee:
SIPLP MICROELECTRONICS CHONGQING CO LTD (CN)
International Classes:
H01L25/07; H01L21/56; H01L23/538
Foreign References:
CN107611100A2018-01-19
TW201415586A2014-04-16
CN1418048A2003-05-14
US20180301418A12018-10-18
CN1437255A2003-08-20
CN111599702A2020-08-28
Attorney, Agent or Firm:
SHANGHAI SAVVY INTELLECTUAL PROPERTY AGENCY (CN)
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