Title:
SEMICONDUCTOR LASER LIGHT SOURCE
Document Type and Number:
WIPO Patent Application WO/2017/141347
Kind Code:
A1
Abstract:
The present invention is provided with: a semiconductor laser element 1 that outputs laser light from an output surface 11; a heat dissipating section 3 that dissipates heat of the semiconductor laser element 1; and a sub-mount 2 having a sub-mount substrate 23 wherein a protruding section 24 is provided on a flat board section 25, a first electrode layer 22 covering one surface of the sub-mount substrate 23, and a second electrode layer 26 covering the other surface of the sub-mount substrate 23. In the sub-mount 2, the first electrode layer 22 is bonded to the semiconductor laser element 1, and the second electrode layer 26 is bonded to the heat dissipating section 3, respectively using a solder, the protruding section 24 is provided from a predetermined position on the one surface of the sub-mount substrate 23 toward a sub-mount substrate end portion on the output surface 11 side, and in the first electrode layer 22, the thickness of a portion in contact with the protruding section 24 is less than the thickness of a portion in contact with the flat board section 25. The semiconductor laser element 1 is provided such that the output surface 11 is aligned with the end portion of the sub-mount 2, or is provided such that the output surface 11 is protruding to the outside by a predetermined value from the end portion of the sub-mount 2.
Inventors:
YAMAMOTO SHUHEI (JP)
FUTAMI MITSUAKI (JP)
IKEDA KAZUTAKA (JP)
FUTAMI MITSUAKI (JP)
IKEDA KAZUTAKA (JP)
Application Number:
PCT/JP2016/054428
Publication Date:
August 24, 2017
Filing Date:
February 16, 2016
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01S5/0239
Foreign References:
| JP2015176925A | 2015-10-05 | |||
| JP2000012959A | 2000-01-14 | |||
| JP2007157869A | 2007-06-21 | |||
| JP2010027942A | 2010-02-04 | |||
| JP2001168445A | 2001-06-22 | |||
| JP2005191209A | 2005-07-14 | |||
| JPH07176820A | 1995-07-14 | |||
| JP2008244427A | 2008-10-09 |
Attorney, Agent or Firm:
INABA, Tadahiko et al. (JP)
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