SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE MANUFACTURING METHOD

WIPO Patent Application WO/2013/179879

A1

A semiconductor module relating to one embodiment of the present invention is provided with: a semiconductor chip; a wiring board; a mounting board having the wiring board mounted thereon; a frame body constituting, with the mounting board, a case for housing the wiring board; and a bus bar, which is led out from the case by being electrically connected to the wiring pattern, and which is inserted into one side wall of the frame body. The one side wall has a protruding portion that is protruding to the inside of the frame body. The bus bar has: a first region embedded in the one side wall; a second region extending to the outer side of the frame body from a first end portion of the first region; and a third region extending to the inner side of the frame body from a second end portion of the first region. The third region is bent on the basis of the shape of the protruding portion on the wiring board side when viewed from the position of the second end portion, and the third region and the wiring pattern are brought into pressure contact with each other when the mounting board having the wiring board mounted thereon is attached to the frame body.

JP7248887	Resin package and light emitting device
JP2747634	[Title of Invention] Surface Mounted Diode
JPS5447479	TAB STRUCTURE OF LEAD FRAMES

SHINKAI JIRO (JP)

PCT/JP2013/063290

December 05, 2013

May 13, 2013

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SUMITOMO ELECTRIC INDUSTRIES (JP)

H01L23/48; H01L25/07; H01L25/18

WO2009069308A1

2009-06-04

JP2001135762A	2001-05-18
JPS63240056A	1988-10-05
JPH11251514A	1999-09-17
JP2006344841A	2006-12-21

See also references of EP 2858109A4

HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)

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