SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE, AND ELECTRONIC CONTROL DEVICE

WIPO Patent Application WO/2015/186470

A1

To improve waterproof effect of a semiconductor module. This semiconductor module is provided with: a semiconductor structure that is provided with a semiconductor element, a conductor member to which the semiconductor element is bonded, a heat dissipation member which is provided such that heat is transferable therefrom to the semiconductor element, and a sealing material which is formed of a material different from that of the heat dissipation member and seals the semiconductor element such that one surface of the heat dissipation member is exposed; a cover layer that covers at least the boundary between the heat dissipation member and the sealing material within a contact region of a coolant; and a waterproof layer which is formed of a material different from that of the cover layer and is formed on the surface of the cover layer.

JP7210646	heat sinks and heat exchangers
JPH05259332	COOLING STRUCTURE OF INTEGRATED CIRCUIT
JPS52130289	LIQUID COOLING BODY FOR THYRISTOR

AMO MINA (JP)
TOKUYAMA TAKESHI (JP)
TSUYUNO NOBUTAKE (JP)
TEMMEI HIROYUKI (JP)
SATOH TOSHIYA (JP)

PCT/JP2015/063406

December 10, 2015

May 11, 2015

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HITACHI AUTOMOTIVE SYSTEMS LTD (JP)

H01L23/473; H01L23/29; H01L25/07; H01L25/18

JP2006128260A	2006-05-18
JP2004119667A	2004-04-15
JPS61166053A	1986-07-26
JPH0260150A	1990-02-28
JP2012191057A	2012-10-04
JP2013105884A	2013-05-30
JP2014013931A	2014-01-23

INOUE Manabu et al. (JP)
Manabu Inoue (JP)

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