Title:
SEMICONDUCTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2020/230349
Kind Code:
A1
Abstract:
This semiconductor module comprises a semiconductor element and a sealing body that seals the semiconductor element. The semiconductor element includes: a semiconductor substrate; a protective film that is formed on a surface of the semiconductor substrate and extends in a bezel-like shape along the outer peripheral edge of the semiconductor substrate; a metal film that is formed on the surface of the semiconductor substrate, at least a portion of the metal film being positioned between the semiconductor substrate and the protective film; and a dummy metal film that is formed on the surface of the semiconductor substrate and is positioned between the metal film and the outer peripheral edge of the protective film. A recessed portion that accommodates a portion of the dummy metal film is formed on the surface of the semiconductor substrate. A recessed portion or a hole that opposes the recessed portion of the semiconductor substrate and accommodates the portion of the dummy metal film is formed on the protective film. That is, the dummy metal film is provided over both the recessed portion of the semiconductor substrate and the recessed portion or hole of the protective film.
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Inventors:
TANAKA JUNJI (JP)
Application Number:
PCT/JP2019/044173
Publication Date:
November 19, 2020
Filing Date:
November 11, 2019
Export Citation:
Assignee:
TOYOTA MOTOR CO LTD (JP)
International Classes:
H01L23/31; H01L23/29; H01L25/07; H01L25/18; H01L29/78
Domestic Patent References:
| WO2015129131A1 | 2015-09-03 |
Foreign References:
| JP2005019734A | 2005-01-20 | |||
| JP2008091618A | 2008-04-17 | |||
| JPH1187691A | 1999-03-30 |
Attorney, Agent or Firm:
KAI-U PATENT LAW FIRM (JP)
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