Title:
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/149133
Kind Code:
A1
Abstract:
The present invention relates to a semiconductor package comprising: an organic substrate having a circuit; a semiconductor chip mounted to a part of one surface of the organic substrate, the semiconductor chip being electrically connected to the circuit; and a metal sheet bonded to at least a part of the one surface of the organic substrate where the semiconductor chip is not installed, the metal sheet not being electrically connected to the circuit, wherein the average coefficient of thermal expansion at 30–260°C of the metal that constitutes the metal sheet is 3–15 ppm/°C.
Inventors:
TAKAHASHI MASAKI (JP)
FUJITA HIROAKI (JP)
SHIMAOKA SHINJI (JP)
NOMA HIROKAZU (JP)
FUJITA HIROAKI (JP)
SHIMAOKA SHINJI (JP)
NOMA HIROKAZU (JP)
Application Number:
PCT/JP2022/047802
Publication Date:
August 10, 2023
Filing Date:
December 26, 2022
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
H01L23/12; H01L23/14; H01L23/36
Domestic Patent References:
| WO2008056499A1 | 2008-05-15 |
Foreign References:
| JP2010103338A | 2010-05-06 | |||
| JP2005302922A | 2005-10-27 | |||
| JP2009252859A | 2009-10-29 | |||
| JP2005217003A | 2005-08-11 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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