Title:
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2020/000184
Kind Code:
A1
Abstract:
Provided by the present invention are a semiconductor structure and a manufacturing method therefor, the semiconductor structure comprising a substrate, the substrate being provided thereon with at least one light guide groove, and the light guide groove passing through the substrate; a light-emitting structure, the light-emitting structure being disposed at a side of the substrate and the light-emitting structure comprising at least one set of first electrodes and second electrodes; the light guide groove at least corresponds to one set of first electrodes and second electrodes so as to prevent dead pixels. A wavelength conversion medium layer is filled into the light guide groove so as to prevent a coffee ring effect, thereby achieving uniform full-color light emission by a light-emitting device; the semiconductor structure may further save manufacturing costs and prevent crosstalk between light emitted from various light-emitting units.
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Inventors:
ZHANG LIYANG (CN)
CHENG KAI (CN)
CHENG KAI (CN)
Application Number:
PCT/CN2018/092886
Publication Date:
January 02, 2020
Filing Date:
June 26, 2018
Export Citation:
Assignee:
ENKRIS SEMICONDUCTOR INC (CN)
International Classes:
H01L33/20; H01L33/00
Foreign References:
| US20030232455A1 | 2003-12-18 | |||
| CN103325914A | 2013-09-25 | |||
| US20070295985A1 | 2007-12-27 | |||
| CN103503171A | 2014-01-08 | |||
| CN1489223A | 2004-04-14 | |||
| CN103390706A | 2013-11-13 |
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