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Patent Searching and Data


Title:
SEMICONDUCTOR WAFER HANDLING AND TRANSPORT
Document Type and Number:
WIPO Patent Application WO/2013/072760
Kind Code:
A4
Abstract:
A substrate processing system including at least two vertically stacked transport chambers, each of the vertically stacked transport chambers including a plurality of openings arranged to form vertical stacks of openings configured for coupling to vertically stacked process modules, at least one of the vertically stacked transport chambers includes at least one transport chamber module arranged for coupling to another transport chamber module to form a linear transport chamber and another of the at least two stacked transport chambers including at least one transport chamber module arranged for coupling to another transport chamber module to form another linear transport chamber, and a transport robot disposed in each of the transport chamber modules, where a joint of the transport robot is locationally fixed along a linear path formed by the respective linear transport chamber.

Inventors:
CAVENEY ROBERT T (US)
Application Number:
PCT/IB2012/002688
Publication Date:
December 12, 2013
Filing Date:
October 26, 2012
Export Citation:
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Assignee:
BROOKS AUTOMATION INC (US)
International Classes:
H01L21/677; B65H1/00
Attorney, Agent or Firm:
MARCOVICI, Janik et al. (LLP99 Hawley Lan, Stratford CT, US)
Download PDF:
Claims:
AMENDED CLAIMS

received by the International Bureau on 10 September 2013 (10.09.2013)

1. A substrate processing system comprising: at least two vertically stacked transport chambers, each of the vertically stacked transport chambers being separate and distinct from another of the at least two vertically stacked transport chambers and including a plurality of openings arranged to form vertical stacks of openings configured for coupling to vertically stacked process modules, at least one of the vertically stacked transport chambers includes at least one transport chamber module arranged for coupling to another transport chamber module to form a linear transport chamber and another of the at least two stacked transport chambers including at least one transport chamber module arranged for coupling to another transport chamber module to form another linear transport chamber separate and distinct from the linear transport chamber; and a transport robot disposed in each of the transport chamber modules, where a joint of the transport robot is locationally fixed along a linear path formed by the respective linear transport chamber.

2. The substrate processing system of claim 1, wherein the transport robot includes a two degree of freedom drive with 2 axis movement.

3. The substrate processing system of claim 1, wherein each of the transport chamber modules are sealable chambers .

4;. The substrate processing system* of claim 1, wherein each of the linear transport chambers includes a buffer station disposed between at least two of the transport chamber modules.

5. The substrate processing system of claim 4, wherein the buffer station includes a substrate elevator configured to transfer substrates between each of the linear transport chambers.

6. The substrate processing system of claim 1, wherein at least one end of each of the at least two vertically stacked transport chambers is communicably coupled to a common loading station, wherein the common loading station includes a substrate elevator for transferring substrates between each of the at least two vertically stacked transport chambers.

7. The substrate processing system of claim 1, wherein transport robots of each of the at least two vertically stacked transport chambers include dual level transport robots that form vertically stacked substrate transfer planes within a respective one of the at least two vertically stacked transport chambers.

8. The substrate processing system of claim 7, wherein the vertically stacked substrate transfer planes allow for bidirectional substrate travel in each of the at least two vertically stacked transport chambers.

9. The substrate processing system of claim 1, wherein one of the vertically stacked substrate transfer planes is a return lane configured for substantially unobstructed transport of substrates.

10. The substrate processing system of claim 1, wherein each of the at least two vertically stacked transport chambers includes lateral sides, wherein the plurality of openings are disposed on but a single lateral side of a respective one of the at least two vertically stacked transport chambers.

11. The substrate processing system of claim 1, wherein each of the at least two vertically stacked transport chambers includes lateral sides, wherein the plurality of openings are disposed on opposite lateral sides of a respective one of the at least two vertically stacked transport chambers.

12. The substrate processing system of claim 1, wherein one of the at least two vertically stacked transport chambers provides substrate transport in a first direction and the other of the at least two vertically stacked transport chambers provides substrate transport in a substantially opposite direction.

13. The substrate processing system of claim 1, wherein the transport robots of a respective linear transport chamber are arranged for robot to robot substrate handoff.

14. A substrate processing system comprising: at least two vertically stacked linear transport chambers, each of the vertically stacked linear transport chambers being separate and distinct from another of the at least two vertically stacked linear transport chambers and arranged in a respective processing level and including a plurality of chambers communicably coupled to each other to form a respective linear transport chamber that is separate and distinct from other ones of the at least two vertically stacked transport tunnels, each respective linear transport chamber having openings arranged for coupling with a process module; and a transport robot disposed in each of the plurality of chambers where a joint of the transport robot is locationally fixed along a linear path formed by the respective linear transport chamber.

15. The substrate processing system of claim 14, wherein the substrate processing system is a modular system configured to accept additional processing levels stacked with existing processing levels.

16. The substrate processing system of claim 14, wherein each of

the at least two vertically stacked linear transport chambers is modular such that' a length of a respective vertically stacked linear transport chamber can be extended independent of other ones of the at least two vertically stacked linear transport chambers.

17. The substrate processing system of claim 14, wherein the openings of the at least two vertically stacked linear transport chambers are arranged to form vertical stacks of openings for coupling with vertically stacked process modules.

18. A substrate processing system comprising.- at least two vertically stacked transport chambers, each vertically stacked transport chamber being separate and distinct from another of the at least two vertically stacked transport chambers and having a plurality of openings, the plurality of openings of the at least two vertically stacked transport chambers being arranged to form vertical stacks of openings for coupling with process cells that include vertically stacked process modules ; and at least one transport robot in each of the at least two vertically stacked transport chambei-s where the at least one transport robot is configured to transport substrates along a length of the tunnel and into respective ones of the vertically stacked process modules, the at least one transport robot having a joint that is locationally fixed along a linear path formed by a respective one of the vertically stacked transport chambers.

19. The substrate processing system of claim 18, wherein each of the at least two vertically .stacked transport chambers includes at least one. chamber configured for coupling with another chamber to form a linear transport chamber.

20. The aubstrate processing system of claim 19, wherein each of

the at least one chamber includes a positionally fixed transport robot .