Title:
SENSOR PACKAGE STRUCTURE MANUFACTURING METHOD AND SENSOR PACKAGE STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2018/196630
Kind Code:
A1
Abstract:
A sensor package structure manufacturing method and a sensor package structure. The sensor package structure manufacturing method comprises: providing a chip (1), a functional circuit being formed on a first surface (111) of the chip (11); forming balls (113) on a second surface (112) of the chip (11) opposite to the first surface (111), the balls (113) being electrically connected to the functional circuit; attaching the first surface (111) of the chip (11) to a first surface (121) of a protection portion (12); forming a packaging layer (14) above the first surface (121) of the protection portion (12), the packaging layer (14) covers the chip (11); thinning the packaging layer (14) distant from the first surface (121) of the protection portion and the balls (113) to form pads (15), the formed pads (15) being partial regions that expose the balls (113). The technical solution can reduce the process difficulty, resolve the problem of scrapping of a sensor package structure due to the flash generated by the open molding, and improve the yield of sensor packages.
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Inventors:
LI YANGYUAN (CN)
Application Number:
PCT/CN2018/082936
Publication Date:
November 01, 2018
Filing Date:
April 13, 2018
Export Citation:
Assignee:
MICROARRAY MICROELECTRONICS CORP LTD (CN)
International Classes:
H01L21/56; H01L21/60; H01L23/31; H01L23/488
Foreign References:
| CN107068578A | 2017-08-18 | |||
| CN101425523A | 2009-05-06 | |||
| CN103943600A | 2014-07-23 | |||
| JP2008209163A | 2008-09-11 |
Attorney, Agent or Firm:
SUZHOU WISPRO INTELLECTUAL PROPERTY AGENCY (CN)
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