Title:
SIGNAL TRANSMISSION STRUCTURE AND MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/046033
Kind Code:
A1
Abstract:
A signal transmission structure (100) and a manufacturing method therefor. The signal transmission structure (100) comprises a first device (10), a second device (20), and a first grounding portion (30). The first device (10) and the second device (20) are disposed in a same signal layer (S1) or different signal layers (S1, S2) of a printed circuit board (200), and the first device (10) and the second device (20) are respectively located in two discrete grounds (60) in one or more signal layers. The first device (10) is configured to transmit a first signal to the second device (20). The first grounding portion (30) is arranged on the printed circuit board (200) and covers the two discrete grounds (60), and the first grounding portion (30) is configured to provide a complete reference ground when the second device (20) returns the first signal to the first device (10). Thus, the integrity of the reference ground of a sensitive signal is ensured, the impact of noise is greatly reduced, and the present invention is suitable for solving a signal integrity or electromagnetic problem caused by an incomplete reference layer of a sensitive signal.
Inventors:
XIE XUTONG (CN)
ZHOU XURAN (CN)
GUO XUDONG (CN)
ZHANG JUNBIAO (CN)
ZHOU XURAN (CN)
GUO XUDONG (CN)
ZHANG JUNBIAO (CN)
Application Number:
PCT/CN2023/111327
Publication Date:
March 07, 2024
Filing Date:
August 04, 2023
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H05K1/02
Foreign References:
| US20190267301A1 | 2019-08-29 | |||
| CN101646334A | 2010-02-10 | |||
| CN101682113A | 2010-03-24 | |||
| US20050063166A1 | 2005-03-24 | |||
| CN103167719A | 2013-06-19 |
Attorney, Agent or Firm:
SHENZHEN SCIENBIZIP INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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