Title:
SILICONE RUBBER COMPOSITION FOR MOLD SURFACE RELEASE TREATMENT, AND METHOD FOR FORMING CURED SILICONE
Document Type and Number:
WIPO Patent Application WO/2015/151480
Kind Code:
A1
Abstract:
A silicone rubber composition for mold surface release treatment, the silicone rubber composition comprising at least (A) alkenyl-group-containing organopolysiloxane represented by an average compositional formula, (B) a silica micropowder having a BET specific surface area of at least 50 m2/g, (C) organopolysiloxane having at least two silicon-atom-bonded hydrogen atoms per molecule, (D) a hydrosilylation reaction catalyst, and (E) a release component having an acid value of 5.0 mg/g or less and a melting point of 40-160ºC. Release treatment of the mold surface for heating and molding a curable silicone composition makes it possible to improve the cleaning cycle of the mold without triggering curing inhibition of the composition.
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Inventors:
YAMAZAKI RYOSUKE (JP)
ICHIKAWA KAZUYA (JP)
ICHIKAWA KAZUYA (JP)
Application Number:
PCT/JP2015/001754
Publication Date:
October 08, 2015
Filing Date:
March 26, 2015
Export Citation:
Assignee:
DOW CORNING TORAY CO LTD (JP)
International Classes:
B29C33/64; C08K3/00; C08L83/05; C08L83/07
Foreign References:
JP2011184589A | 2011-09-22 | |||
JP2013103963A | 2013-05-30 |
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