Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SNZN SOLDER AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2021/010199
Kind Code:
A1
Abstract:
The present invention pertains to: a SnZn solder characterized in that a total 1–1.5 wt% of a principal material including at least one element from among P, In, Bi, and Sb is mixed with a base material that is an alloy of Sn and Zn, and the mixture is melted to form an alloy; and a production method therefor. The present invention makes it possible to provide a low-cost solder that can bond very securely to an electrode of a solar cell substrate, or the like, performs well in temperature cycle testing, and has a melting temperature which is substantially the same as or lower than that of a SnZn alloy serving as the base material.

More Like This:
JP2022043722Sn-In-BASED LOW MELTING POINT BONDING MEMBER AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR ELECTRONIC CIRCUIT AND MOUNTING METHOD THEREOF
JPH0929480SOLDER PASTE
JP2023106062SOLDER AND SEMICONDUCTOR DEVICE
Inventors:
OKADA MORIHIRO (JP)
ARAI KATSUYA (JP)
SUGAWARA MIEKO (JP)
KOBAYASHI KENICHI (JP)
KOMIYA HIDETOSHI (JP)
MATSUI SHOGO (JP)
NISHIGORI JUN (JP)
MORI NAOHISA (JP)
Application Number:
PCT/JP2020/026311
Publication Date:
January 21, 2021
Filing Date:
July 04, 2020
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
ARTBEAM CO LTD (JP)
OKADA MORIHIRO (JP)
International Classes:
B23K35/26; B23K1/00; C22C1/02; C22C13/00; C22C13/02
Domestic Patent References:
WO2003061896A12003-07-31
WO1997012719A11997-04-10
WO2004039533A12004-05-13
Foreign References:
CN101092006A2007-12-26
JPH09155587A1997-06-17
JP2002361476A2002-12-18
JP2000015478A2000-01-18
JP2009502512A2009-01-29
JP2003010996A2003-01-15
Attorney, Agent or Firm:
OKADA Morihiro (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: MICROSCOPE SYSTEM AND OBSERVATION METHOD

Next Patent: INFORMATION PROCESSING DEVICE AND METHOD