SOLID-STATE IMAGE PICKUP DEVICE AND IMAGE PICKUP APPARATUS

WIPO Patent Application WO/2015/166900

A1

A solid-state image pickup device is provided with: a first substrate which has a pixel part divided into a plurality of groups obtained by dividing a plurality of pixels arranged in a two-dimensional matrix into groups of a plurality of predetermined rows each; and a second substrate which is provided with, for each column of pixels belonging to the group, a pixel load current source corresponding to a vertical signal line to which a plurality of pixels arranged in the same column in the group are connected, and a column circuit for performing predetermined processing on a pixel signal outputted to the vertical signal line corresponding thereto, and has a plurality of signal processing circuits that correspond to the respective groups and each output an image signal processed by each of the column circuits to each column of pixels, and the first substrate and the second substrate are laminated and electrically connected via respective inter-substrate connection parts corresponding to the vertical signal lines.

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KONDO TORU (JP)

PCT/JP2015/062663

November 05, 2015

April 27, 2015

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OLYMPUS CORP (JP)

H04N5/3745; H01L27/146

WO2014007004A1	2014-01-09
WO2013041924A1	2013-03-28

JP2011135194A	2011-07-07
JP2012257095A	2012-12-27
JP2013168623A	2013-08-29
JP2007228460A	2007-09-06

TANAI Sumio et al. (JP)
Sumio Tanai (JP)

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