Title:
SOLID-STATE IMAGING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/022119
Kind Code:
A1
Abstract:
This solid-state imaging device comprises a plurality of imaging element blocks 10, each of which is composed of a plurality of imaging elements 11. Each imaging element 11 is provided with: a first electrode 21; a charge storage electrode 24 that is arranged at a distance from the first electrode 21; a photoelectric conversion part 23 which is formed above the charge storage electrode 24, with an insulating layer being interposed therebetween, so as to be in contact with the first electrode 21; and a second electrode 22 which is formed on the photoelectric conversion part 23. The first electrode 21 and the charge storage electrode 24 are formed on an interlayer insulating layer 81; and the first electrode 21 is connected to a connection part 63 (64, 65) that is formed within the interlayer insulating layer 81.
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Inventors:
SATO YUSUKE (JP)
Application Number:
PCT/JP2019/027890
Publication Date:
January 30, 2020
Filing Date:
July 16, 2019
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146; H04N5/369
Domestic Patent References:
| WO2014112279A1 | 2014-07-24 | |||
| WO2014002366A1 | 2014-01-03 |
Foreign References:
| JP2018085402A | 2018-05-31 | |||
| JP2015177323A | 2015-10-05 | |||
| JP2012151771A | 2012-08-09 | |||
| JP2017157816A | 2017-09-07 |
Other References:
See also references of EP 3828933A4
Attorney, Agent or Firm:
YAMAMOTO Takahisa et al. (JP)
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