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Title:
SPUTTERING DEVICE
Document Type and Number:
WIPO Patent Application WO/2011/108489
Kind Code:
A1
Abstract:
Disclosed is a sputtering device (1) provided with a vacuum chamber (11), a plurality of targets (132a-132d) arranged in parallel having a specified distance therebetween and disposed opposite of a substrate provided in the vacuum chamber, a power source to apply voltage to the targets, and a gas introduction means (12) for introducing gas into the vacuum chamber. The sputtering device also has shields (20) that cover the upper surfaces of the ends of the targets.

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Inventors:
NAKAJIMA TEPPEI (JP)
KIM JUNG-GUN (KR)
JEONG BYEONG-HWA (KR)
LEE SANG-HO (KR)
Application Number:
PCT/JP2011/054503
Publication Date:
September 09, 2011
Filing Date:
February 28, 2011
Export Citation:
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Assignee:
ULVAC INC (JP)
NAKAJIMA TEPPEI (JP)
KIM JUNG-GUN (KR)
JEONG BYEONG-HWA (KR)
LEE SANG-HO (KR)
International Classes:
C23C14/34
Foreign References:
JP2009263744A2009-11-12
JP2008001988A2008-01-10
JP2001214262A2001-08-07
Attorney, Agent or Firm:
KURIHARA, Hiroyuki et al. (JP)
Hiroyuki Kurihara (JP)
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