STACKED CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

WIPO Patent Application WO/2005/083727

A1

A stacked ceramic electronic component and a manufacturing method thereof are provided. The stacked ceramic electronic component has an external electrode wherein sintered electrode layers, middle electrolytic plating layers and electrolytic plating layers are stacked in this order, does not easily generate insulation resistance failure in a high-temperature load test and has high reliability. On both edge surfaces (4a) and (4b) of a ceramic sintered body (4) having internal electrodes (2) and (3), first and second external electrodes (5) and (6) are formed. Each of the external electrodes (5) and (6) has a structure wherein the sintered electrode layers (5a) and (6a), middle electrolytic plating layers (5b) and (6b) and electrolytic plating layers (5c) and (6c) are stacked in this order. On the outer surfaces of the sintered electrode layers (5a) and (6a), exposing surface parts (7a) of an insulating oxide (7) based on a glass frit contained in the sintered electrode layer are exposed. Under the condition where a metal (8) is deposited on the exposing surface parts (7a), middle electrolytic layers (5b) and (6b) are formed by electrolytic plating.

HORIE SHIGEYUKI (JP)
DOZEN TOMOHIRO (JP)
NOJI TAKASHI (JP)
FURUSAWA TATSUO (JP)
KAWAI TAKAAKI (JP)

PCT/JP2005/001418

September 09, 2005

February 01, 2005

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MURATA MANUFACTURING CO (JP)
HORIE SHIGEYUKI (JP)
DOZEN TOMOHIRO (JP)
NOJI TAKASHI (JP)
FURUSAWA TATSUO (JP)
KAWAI TAKAAKI (JP)

H01G4/12; H01G4/232; H01G4/252; H01G4/30; (IPC1-7): H01G4/12; H01G4/252; H01G4/30

JPH0897075A	1996-04-12
JPH08203770A	1996-08-09
JPH0837127A	1996-02-06
JP2001200163A	2001-07-24

See also references of EP 1720181A4

Miyazaki, Chikara (5-4 Tanimachi 1-chome, Chuo-k, Osaka-shi Osaka, JP)

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