SUBSTRATE CLEANER FOR COPPER WIRING, AND METHOD FOR CLEANING COPPER WIRING SEMICONDUCTOR SUBSTRATE

Title:

SUBSTRATE CLEANER FOR COPPER WIRING, AND METHOD FOR CLEANING COPPER WIRING SEMICONDUCTOR SUBSTRATE

Document Type and Number:

WIPO Patent Application WO/2012/073909

Kind Code:

A1

Abstract:

The present invention addresses the problems of: providing a substrate cleaner for copper wiring which sufficiently suppresses the elution of metal copper during the cleaning of a semiconductor substrate after the chemical mechanical polishing (CMP) step in a process for manufacturing the semiconductor substrate, and which permits the removal of particles and impurities such as copper (II) hydroxide and copper (II) oxide generated during the chemical mechanical polishing step (CMP); and of providing a method for cleaning a copper wiring semiconductor substrate characterized by the use of this substrate cleaner for copper wiring. The present invention relates to a substrate cleaner for copper wiring comprising an aqueous solution containing [I] an amino acid represented by General Formula (1), and [II] an alkylhydroxylamine; and to a method for cleaning a copper wiring semiconductor substrate characterized by the use of this substrate cleaner for copper wiring. (In the formula, R1 represents a hydrogen atom, a carboxymethyl group, or a carboxyethyl group; and R2 and R3 each independently represent a hydrogen atom, or a C1-4 alkyl group which may have a hydroxyl group. R1 to R3 cannot all be hydrogen atoms.)

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Inventors:

KAWADA HIROMI (JP)
SHIRAHATA SATOSHI (JP)
MIZUTA HIRONORI (JP)
KAKIZAWA MASAHIKO (JP)
SHIRAKI KAZUO (JP)

Application Number:

PCT/JP2011/077436

Publication Date:

June 07, 2012

Filing Date:

November 28, 2011

Export Citation:

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Assignee:

WAKO PURE CHEM IND LTD (JP)
KAWADA HIROMI (JP)
SHIRAHATA SATOSHI (JP)
MIZUTA HIRONORI (JP)
KAKIZAWA MASAHIKO (JP)
SHIRAKI KAZUO (JP)

International Classes:

C11D7/32; C11D7/08; C11D7/10; H01L21/304

Domestic Patent References:

WO2005040325A1

2005-05-06

Foreign References:

JP2010177702A	2010-08-12
JP2010535422A	2010-11-18
JPH09153472A	1997-06-10
JP2002299300A	2002-10-11
JP2005217114A	2005-08-11
JP2006063201A	2006-03-09
JP2001517863A	2001-10-09
JP2002359223A	2002-12-13

Other References: