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Patent Searching and Data


Title:
SUBSTRATE MATCHING CIRCUIT, RADIO FREQUENCY POWER AMPLIFIER, AND RADIO FREQUENCY CHIP
Document Type and Number:
WIPO Patent Application WO/2023/088002
Kind Code:
A1
Abstract:
The present utility model provides a substrate matching circuit, comprising a transmitting matching circuit, and a first receiving matching circuit and a second receiving matching circuit respectively connected to the transmitting matching circuit. The first receiving matching circuit is adapted to an isolation degree between a power amplification signal transmitting end and a first received signal end; the second receiving matching circuit is adapted to an isolation degree between the power amplification signal transmitting end and a second received signal end; and a power amplification signal transmitting signal enhances an isolation degree between a power amplification signal and a received signal while being filtered by means of a substrate, such that the filtering effect, loss and isolation degree of a signal in the substrate matching circuit during transmitting and receiving are balanced, and the reliability is better. The present utility model further provides a radio frequency power amplifier and a radio frequency chip. Compared with the prior art, the substrate matching circuit, the radio frequency power amplifier, and the radio frequency chip of the present utility model are good in transmission adaptability, small in size and low in production cost.

Inventors:
YU WEIDONG (CN)
GUO JIASHUAI (CN)
Application Number:
PCT/CN2022/125448
Publication Date:
May 25, 2023
Filing Date:
October 14, 2022
Export Citation:
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Assignee:
LANSUS TECH INC (CN)
International Classes:
H03F1/02; H03F1/56; H03H7/01; H03H7/38
Foreign References:
CN216437156U2022-05-03
CN110932747A2020-03-27
CN107046407A2017-08-15
CN110784185A2020-02-11
JP2002271104A2002-09-20
US20100210299A12010-08-19
Attorney, Agent or Firm:
SHENZHEN JUNXINCHENG INTELLECTUAL PROPERTY FIRM (GENERAL PARTNERSHIP) (CN)
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