Title:
SUBSTRATE PROCESSING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/066829
Kind Code:
A1
Abstract:
A substrate processing apparatus according to the present invention comprises: a substrate holder for holding a plurality of substrates arrayed at a prescribed spacing; a reaction tube that is provided with a ceiling that closes off an upper end thereof, and an opening at the bottom thereof into which the substrate holder can be inserted and removed, the reaction tube accommodating the substrate holder; a heating mechanism that is provided to the periphery of the reaction tube and heats the interior thereof; a gas supply mechanism that supplies a treatment gas to the plurality of substrates held by the substrate holder within the reaction tube; a gas evacuation mechanism that communicates with the interior of the reaction tube and evacuates the atmosphere within the reaction tube; and a break filter which is provided at a position, within the reaction tube, partway along the flow of gas from the gas supply mechanism to the gas evacuation mechanism and downstream of the substrates, the break filter receiving heat from the evacuated gas and supplying a supplied inert gas to the interior of the reaction tube.
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Inventors:
SHIMADA HIRONORI (JP)
TANIYAMA TOMOSHI (JP)
TANIYAMA TOMOSHI (JP)
Application Number:
PCT/JP2019/036734
Publication Date:
April 02, 2020
Filing Date:
September 19, 2019
Export Citation:
Assignee:
KOKUSAI ELECTRIC CORP (JP)
International Classes:
H01L21/31; C23C16/44; C23C16/455
Foreign References:
| JP2000058530A | 2000-02-25 | |||
| JP2006041200A | 2006-02-09 | |||
| JP2001284260A | 2001-10-12 | |||
| JP2000223432A | 2000-08-11 | |||
| JP2002299327A | 2002-10-11 |
Attorney, Agent or Firm:
POLAIRE I.P.C. (JP)
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