Title:
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2007/023951
Kind Code:
A1
Abstract:
A substrate processing apparatus is provided with a plurality of process chambers
for performing prescribed processing to a substrate to be processed, and a common
transfer chamber (102) which is commonly connected to the process chambers and
carries in and out the substrates to and from the process chambers, respectively.
The process chambers include adhered material removing process chambers (104A,
104B) for removing an adhered material including a native oxide adhered on the
substrate by chemical reaction with a gas component not using plasma and heat
treatment; film forming process chambers (104C, 104D) for forming a film on the
substrate; and a measuring process chamber (400) for measuring the substrate.
Inventors:
KANEMARU HIDETADA (JP)
HERAI TAKEBU (JP)
YASUHARA MOYURU (JP)
HERAI TAKEBU (JP)
YASUHARA MOYURU (JP)
Application Number:
PCT/JP2006/316747
Publication Date:
March 01, 2007
Filing Date:
August 25, 2006
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
KANEMARU HIDETADA (JP)
HERAI TAKEBU (JP)
YASUHARA MOYURU (JP)
KANEMARU HIDETADA (JP)
HERAI TAKEBU (JP)
YASUHARA MOYURU (JP)
International Classes:
H01L21/304; C23C16/02; H01L21/027; H01L21/31
Foreign References:
| JP2004363316A | 2004-12-24 | |||
| JP2004119635A | 2004-04-15 | |||
| JP2005039185A | 2005-02-10 | |||
| JP2003297822A | 2003-10-17 | |||
| JP2004071796A | 2004-03-04 | |||
| JP2003098112A | 2003-04-03 |
Attorney, Agent or Firm:
YOSHITAKE, Kenji et al. (Room 323 Fuji Bldg., 2-3, Marunouchi 3-chom, Chiyoda-ku Tokyo 05, JP)
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