Title:
SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/008039
Kind Code:
A1
Abstract:
Provided is a technology capable of expanding the size of a plasma reactor and improving uniformity of substrate processing. This substrate processing device is provided with a substrate holding unit (3), a plurality of guards (7), a plasma reactor (1), a first elevator mechanism (15), and a second elevator mechanism (75). The substrate holding unit (3) holds a substrate (W). The plurality of guards (7) have a cylindrical shape surrounding the substrate holding unit (3), and are provided concentrically. The plasma reactor (1) is provided vertically upward of the substrate holding unit (3), and extends outward of the peripheral edges of the substrate as seen in a plan view. The plasma reactor (1) radiates a plasma onto the substrate (W) in a processing state in which the plurality of guards (7) are positioned at a lower position where an upper end (711) of an inner circumferential surface of the outermost guard (7A) is vertically downward of an upper surface of the substrate (W), and the plasma reactor (1) is positioned at a plasma processing position in close proximity to the substrate (W).
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Inventors:
NAMBA TOSHIMITSU (JP)
NISHIDE HAJIME (JP)
NISHIDE HAJIME (JP)
Application Number:
PCT/JP2022/025529
Publication Date:
February 02, 2023
Filing Date:
June 27, 2022
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/304; H05H1/24
Foreign References:
| JP2020031176A | 2020-02-27 | |||
| JP2020031177A | 2020-02-27 | |||
| JP2008053728A | 2008-03-06 | |||
| JP2004096086A | 2004-03-25 | |||
| JP2002370059A | 2002-12-24 | |||
| JP2020004561A | 2020-01-09 | |||
| JP2020181892A | 2020-11-05 | |||
| JP2017208435A | 2017-11-24 | |||
| JP2020198356A | 2020-12-10 | |||
| JP2018032728A | 2018-03-01 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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