Title:
SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/195340
Kind Code:
A1
Abstract:
This substrate processing device comprises a first substrate holding part, a cup, a processing fluid supply part, and a processing tank. The first substrate holding part suctions a lower surface center section of a substrate and holds the substrate horizontally. The cup is open in a ring shape in the vertical direction and surrounds the outer periphery of the substrate held by the first substrate holding part. The processing fluid supply part supplies a processing fluid to the substrate surrounded by the cup. The processing tank recovers the processing fluid falling from the cup. The inner wall surface of the processing tank has a side surface and a bottom surface and at least a portion of the bottom surface is a hydrophilic surface.
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Inventors:
OBARU TAKANORI (JP)
NOGAMI JUN (JP)
NOGAMI JUN (JP)
Application Number:
PCT/JP2023/011154
Publication Date:
October 12, 2023
Filing Date:
March 22, 2023
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/304
Foreign References:
| JPH10258249A | 1998-09-29 | |||
| JP2018018856A | 2018-02-01 | |||
| JP2019106531A | 2019-06-27 | |||
| JPH0522067U | 1993-03-23 | |||
| JP2013201200A | 2013-10-03 | |||
| JP2002190464A | 2002-07-05 | |||
| JP2004047714A | 2004-02-12 | |||
| JP2006147672A | 2006-06-08 | |||
| JPH01161834A | 1989-06-26 | |||
| JPH11219881A | 1999-08-10 | |||
| JPH01260823A | 1989-10-18 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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