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Title:
SUBSTRATE PROCESSING DEVICE, PROCESS LIQUID, AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/039784
Kind Code:
A1
Abstract:
This substrate processing device (1) is provided with a substrate holding unit (2), a process liquid supply unit, a heating unit (5), and a liquid removal unit. The substrate holding unit (2) holds a substrate (9) in a horizontal state. The process liquid supply unit supplies a process liquid having a higher surface tension than IPA on an upper surface (91) of the substrate (9), thereby forming a liquid film of the process liquid covering over the entire surface of the upper surface (91) of the substrate (9). The heating unit (5) heats the substrate (9) from the lower surface (92) side to vaporize a part of the liquid film, thereby forming a gas-phase layer between the upper surface (91) of the substrate (9) and the liquid film. The liquid removal unit removes the liquid film on the gas-phase layer. This makes it possible to suppress unintended damage to the liquid film.

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Inventors:
OKUTANI MANABU (JP)
ABE HIROSHI (JP)
YASHIKI HIROYUKI (JP)
Application Number:
PCT/JP2019/027399
Publication Date:
February 27, 2020
Filing Date:
July 10, 2019
Export Citation:
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Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/304
Foreign References:
JP2015185767A2015-10-22
JP2016162847A2016-09-05
JP2000097564A2000-04-04
JP2017183634A2017-10-05
Attorney, Agent or Firm:
MATSUSAKA, Masahiro et al. (JP)
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