Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/115239
Kind Code:
A1
Abstract:
This substrate processing device is provided with: a substrate support unit (141) that supports a substrate (9) from below; a substrate rotating mechanism that rotates the substrate support unit; and a top plate (123) that opposes the top surface (91) of the substrate. The top plate is selectively disposed at a concatenation position concatenated to the substrate support unit and a separated position separated upwards from the substrate support unit by means of an opposing unit support mechanism. The substrate support unit is provided with a chuck unit (4) having a plurality of claws (41) and a transmission mechanism (42), and when the top plate is positioned at the concatenation position, the abutment sections (43) of the transmission mechanism are pressed in by means of the dead weight of the top plate. The plurality of claws of the transmission mechanism press the edges of the substrate towards the center axis by means of the force acting on the abutment sections being transmitted to the plurality of claws. As a result, the substrate is held while being positioned with respect to the center of rotation.

More Like This:
Inventors:
ANDO KOJI (JP)
Application Number:
PCT/JP2015/051310
Publication Date:
August 06, 2015
Filing Date:
January 20, 2015
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/027; H01L21/306; H01L21/683
Foreign References:
JP2001338903A2001-12-07
JP2012200673A2012-10-22
JP2002368066A2002-12-20
JP2004200367A2004-07-15
JP2007103730A2007-04-19
JP2013093407A2013-05-16
Attorney, Agent or Firm:
MATSUSAKA, Masahiro et al. (JP)
Matsusaka Masahiro (JP)
Download PDF:



 
Previous Patent: CURRENT SENSOR

Next Patent: BALL SCREW