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Patent Searching and Data


Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2019/230349
Kind Code:
A1
Abstract:
This substrate processing method comprises: a substrate holding step wherein a substrate is held horizontally; a rinsing liquid film formation step wherein a rinsing liquid is supplied to the upper surface of the substrate, said upper surface having been hydrophobilized, so as to form a rinsing liquid film on the upper surface of the substrate; a sulfuric acid-containing liquid film formation step wherein sulfuric acid is supplied to the upper surface of the substrate, which holds the rinsing liquid film, so as to form a sulfuric acid-containing liquid film that contains the sulfuric acid on the upper surface of the substrate; and an SPM liquid supply step wherein an SPM liquid that is a mixed liquid of sulfuric acid and a hydrogen peroxide solution is supplied to the upper surface of the substrate, which holds the sulfuric acid-containing liquid film.

Inventors:
ENDO TORU (JP)
HAYASHI MASAYUKI (JP)
SHIBAYAMA NOBUYUKI (JP)
Application Number:
PCT/JP2019/018876
Publication Date:
December 05, 2019
Filing Date:
May 13, 2019
Export Citation:
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Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/304; H01L21/027
Foreign References:
JP2015109335A2015-06-11
Attorney, Agent or Firm:
AI ASSOCIATION OF PATENT AND TRADEMARK ATTORNEYS (JP)
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