Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/203060
Kind Code:
A1
Abstract:
A substrate processing method, provided with: a step (step S12) for reducing the amount of oxygen dissolved in a processing solution and generating a low-oxygen processing solution; and a step (step S14) for feeding the low-oxygen processing solution to a substrate, which has a first metal part and a second metal part in contact with the first metal part formed on a main surface (i.e., upper surface) thereof, and processing the upper surface. In step S14, the low-oxygen processing solution is brought into contact with an interface between the first metal part and the second metal part, whereby an oxygen reduction reaction in the second metal part, which is more noble than the first metal part, is inhibited, and dissolution of the first metal part is inhibited. According to this substrate processing method, dissolution of the metal part (i.e., the first metal part) on the substrate can be satisfactorily inhibited.
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Inventors:
TAKAHASHI HIROAKI (JP)
AKANISHI YUYA (JP)
AKANISHI YUYA (JP)
Application Number:
PCT/JP2019/015446
Publication Date:
October 24, 2019
Filing Date:
April 09, 2019
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/304; B08B3/02; C23F1/00; C23G1/00; H01L21/306; H01L21/3205; H01L21/768
Foreign References:
| JP2010165757A | 2010-07-29 | |||
| JP2018026461A | 2018-02-15 | |||
| JP2017028091A | 2017-02-02 | |||
| JP2009218403A | 2009-09-24 |
Attorney, Agent or Firm:
MATSUSAKA, Masahiro et al. (JP)
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