SUBSTRATE PRODUCING METHOD AND RESIN SUBSTRATE

WIPO Patent Application WO/2011/024469

A1

A wiring within a resin layer of a resin substrate such as a substrate with embedded components is formed by a method completely different from a conventional method using a via conductor, so that a position misalignment of the via conductor or the leakage of a conductive paste can be prevented, and a wire can be made thinner. Thus, the size of the resin substrate can be further reduced than ever before. A substrate precursor (2) on which a wiring element (4) is disposed in a planar manner is prepared. A substrate precursor (2a) is cut into pieces so as to divide the wiring element (4) and the precursor pieces (20a) (pieces of the substrate precursor (2)) are set so that the wiring element pieces (40) (pieces of the wiring element (4)) are standing up. The precursor pieces (20a) are covered with a resin to form a resin layer (3) in which the wiring element pieces (40) are vertically embedded. End face conductors of the wiring element pieces (40) are electrically connected to in-plane conductor patterns (7) provided on the surface of the resin layer (3), to produce a component-contained substrate (resin substrate) (1A).

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SEKIMOTO YASUYUKI (JP)

PCT/JP2010/005288

March 03, 2011

August 27, 2010

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MURATA MANUFACTURING CO (JP)
SEKIMOTO YASUYUKI (JP)

H05K3/46; H05K3/00

JP2005285945A	2005-10-13
JP2004527898A	2004-09-09
JP2001111195A	2001-04-20
JP2002232111A	2002-08-16
JPH10270809A	1998-10-09
JP2001077290A	2001-03-23
JP2001135936A	2001-05-18

YANASE, Yuji et al. (JP)
Yuji Yanase (JP)

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