SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT DEVICE

WIPO Patent Application WO/2019/230404

A1

A substrate treatment method, including: a treatment solution feeding step for feeding a treatment solution onto the surface of a substrate; an object-for-removal expansion step for solidifying or curing the treatment solution fed onto the surface of the substrate in a state of being in contact with an object for removal present on the surface of the substrate, and thereby expanding the apparent size of the object for removal; and a removal step for feeding a stripping solution to the surface of the substrate, stripping the object for removal, the apparent size of which has been expanded, from the surface of the substrate, and removing the object for removal from the surface of the substrate while maintaining the state in which the apparent size of the object for removal has been expanded.

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YOSHIDA YUKIFUMI (JP)
OKUTANI MANABU (JP)
YASUDA SHUICHI (JP)
KANEMATSU YASUNORI (JP)
UEDA DAI (JP)
ZHANG SONG (JP)

PCT/JP2019/019330

December 05, 2019

May 15, 2019

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SCREEN HOLDINGS CO LTD (JP)

H01L21/304

JP2015095583A	2015-05-18
JP2016036012A	2016-03-17
JPH11101970A	1999-04-13

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