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Title:
SURFACE-TREATED COPPER FOIL AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2021/131359
Kind Code:
A1
Abstract:
In order to avoid damage to an electronic component caused by corrosion, there are provided a surface-treated copper foil and a method for manufacturing the same, the surface-treated copper foil being such that it is possible to maintain the strength of adhesion between an electroconductive copper foil and a resin substrate even when the surface-treated copper foil is exposed to a corrosive gas or microparticles. This surface-treated copper foil comprises at least an electroconductive copper foil, a roughened layer that covers at least the surface side of the electroconductive copper foil, and an anti-corrosion layer that furthermore covers the roughened layer, the surface-treated copper foil being such that the anti-corrosion layer is located on at least one surface of the surface-treated copper foil and is provided with at least a nickel layer, the thickness of the nickel layer is 0.8-4.4 g/m2 in terms of mass of nickel per unit area, the non-contact roughness Spd of the anti-corrosion layer is 1.4-2.6 per μm2, and the surface roughness Rz JIS of the anti-corrosion layer is 1.0-2.5 μm. This method for manufacturing a surface-treated copper foil includes: forming on one surface of an electroconductive copper foil, a roughened layer having a roughness that is higher than the abovementioned non-contact roughness Spd and surface roughness RzJIS; and subsequently forming an anti-corrosion layer that satisfies the abovementioned prescribed conditions.

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Inventors:
KAWASAKI TOSHIO (JP)
ENDO YASUHIRO (JP)
Application Number:
PCT/JP2020/041840
Publication Date:
July 01, 2021
Filing Date:
November 10, 2020
Export Citation:
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Assignee:
NIPPON DENKAI LTD (JP)
International Classes:
C25D7/06; C25D5/12; C25D5/16
Domestic Patent References:
WO2017179416A12017-10-19
WO2013147116A12013-10-03
WO2018110579A12018-06-21
WO2018181726A12018-10-04
Foreign References:
JP2014133936A2014-07-24
JP2011179078A2011-09-15
JP2005248323A2005-09-15
JPS5339376B11978-10-20
JP3949871B22007-07-25
Other References:
See also references of EP 4083272A4
Attorney, Agent or Firm:
OKUYAMA, Shoichi et al. (JP)
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