TAPE FOR PROCESSING WAFER, METHOD FOR MANUFACTURING TAPE FOR PROCESSING WAFER, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

WIPO Patent Application WO/2012/050134

A1

In a tape (1) for processing a wafer, corresponding to a region (P) to be attached to a wafer ring (14), semicircular or tongue-like cuts (11) that face the center side of an adhesive layer (3) in planar view are formed with a depth that reaches a peeling base material (2) from the side of a base material film (5). With the cuts (11) thus formed, portions of a cohesive layer (4) and the base material film (5) peel first, said portions being outside of the cuts (11), and the portion inside of the cuts (11) is left in a protruding state on a wafer ring (14) when a peeling force operates to the tape (1). Consequently, peeling strength between the tape (1) and the wafer ring (14) is improved, and peeling of the tape (1) from the wafer ring (14) in a manufacture step is suppressed.

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TANIGUCHI KOUHEI (JP)
MATSUZAKI TAKAYUKI (JP)
KATOU SHINYA (JP)
KOMORIDA KOUJI (JP)
MASHINO MICHIO (JP)
SAKUTA TATSUYA (JP)
KATOU RIE (JP)

PCT/JP2011/073436

April 19, 2012

October 12, 2011

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HITACHI CHEMICAL CO LTD (JP)
TANIGUCHI KOUHEI (JP)
MATSUZAKI TAKAYUKI (JP)
KATOU SHINYA (JP)
KOMORIDA KOUJI (JP)
MASHINO MICHIO (JP)
SAKUTA TATSUYA (JP)
KATOU RIE (JP)

H01L21/301; C09J7/20; H01L23/29; H01L23/31

JP2008153587A	2008-07-03
JP2005350520A	2005-12-22
JP2006111727A	2006-04-27
JP2007242726A	2007-09-20
JP2009218397A	2009-09-24
JP2010192856A	2010-09-02

HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)

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