Title:
TEMPLATE SUBSTRATE AND MANUFACTURING METHOD AND MANUFACTURING APPARATUS THEREOF, SEMICONDUCTOR SUBSTRATE AND MANUFACTURING METHOD AND MANUFACTURING APPARATUS THEREOF, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/002865
Kind Code:
A1
Abstract:
This template substrate is provided with: a main substrate which includes silicon and has an edge; a mask which is positioned above the main substrate and has an opening; a seed part which is positioned above the main substrate and at the opening; and a protective part which overlaps the edge in a side view and includes a material different from gallium.
Inventors:
KAMIKAWA TAKESHI (JP)
AOKI YUTA (JP)
KOBAYASHI TOSHIHIRO (JP)
AOKI YUTA (JP)
KOBAYASHI TOSHIHIRO (JP)
Application Number:
PCT/JP2022/027064
Publication Date:
January 26, 2023
Filing Date:
July 08, 2022
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
C30B29/38; C30B25/18; H01L21/20; H01L21/205
Foreign References:
| JP2009256154A | 2009-11-05 | |||
| JP2012114263A | 2012-06-14 | |||
| JP2007246289A | 2007-09-27 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
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