Title:
TERMINAL MATERIAL FOR CONNECTORS
Document Type and Number:
WIPO Patent Application WO/2021/029254
Kind Code:
A1
Abstract:
Provided is a terminal material for connectors, the terminal material comprising a base material in which at least a surface layer is made from copper or a copper alloy, a nickel plating layer which covers the surface of the base material and is made from nickel or a nickel alloy, and a silver-nickel alloy plating layer which is formed on at least a part of the nickel plating layer and has a film thickness of 0.5 to 20 μm inclusive, a nickel content of 0.03 to 1.20 at% inclusive and an average crystal grain diameter of 10 to 150 nm inclusive, and the terminal material being capable of improving wear resistance and heat resistance.
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Inventors:
TARUTANI YOSHIE (JP)
KUBOTA KENJI (JP)
KUBOTA KENJI (JP)
Application Number:
PCT/JP2020/029688
Publication Date:
February 18, 2021
Filing Date:
August 03, 2020
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C25D5/14; C22C5/06; H01R13/03
Domestic Patent References:
| WO2016157713A1 | 2016-10-06 |
Foreign References:
| JP2001003194A | 2001-01-09 | |||
| JP2007046142A | 2007-02-22 | |||
| JP2018199839A | 2018-12-20 | |||
| JP2013189680A | 2013-09-26 | |||
| JP2009079250A | 2009-04-16 | |||
| JPS461946B1 | 1971-01-18 | |||
| JP2019146951A | 2019-09-05 | |||
| JP2020078202A | 2020-05-21 | |||
| JP2008169408A | 2008-07-24 | |||
| JP2009079250A | 2009-04-16 |
Attorney, Agent or Firm:
AOYAMA, Masakazu (JP)
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