Title:
TERMINAL MATERIAL FOR CONNECTORS
Document Type and Number:
WIPO Patent Application WO/2021/065866
Kind Code:
A1
Abstract:
This terminal material has: a substrate in which at least the surface thereof is made of Cu or a Cu alloy; a Ni layer provided on the substrate and having a thickness of 0.1-1.0 µm; an Cu-Sn intermetallic compound layer provided on the Ni layer and having a thickness of 0.2-2.5 µm; and a Sn layer provided on the Cu-Sn intermetallic compound layer and having a thickness of 0.5-3.0 μm, wherein a boundary at which an orientation difference between adjacent pixels is 2° or more as analyzed in measurement steps of 0.1 µm by EBSD performed on the cross-sections of the Cu-Sn intermetallic compound layer and the Sn layer is assumed as a crystal grain boundary, the Cu-Sn intermetallic compound layer has an average crystal grain size Dc of 0.5 µm or more, and the grain size ratio Ds/Dc of the average crystal grain size Ds of the Sn layer and the average crystal grain size Dc is 5 or less.
Inventors:
MIYASHIMA NAOKI (JP)
MAKI KAZUNARI (JP)
FUNAKI SHINICHI (JP)
ISHIKAWA SEIICHI (JP)
MAKI KAZUNARI (JP)
FUNAKI SHINICHI (JP)
ISHIKAWA SEIICHI (JP)
Application Number:
PCT/JP2020/036807
Publication Date:
April 08, 2021
Filing Date:
September 29, 2020
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C25D5/50; C22C9/00; C25D5/12; C25D7/00; H01R13/03
Domestic Patent References:
| WO2018135482A1 | 2018-07-26 |
Foreign References:
| JP2016056424A | 2016-04-21 | |||
| JP2010168598A | 2010-08-05 | |||
| JP2019181011A | 2019-10-24 | |||
| JP2014122403A | 2014-07-03 | |||
| JP2003293187A | 2003-10-15 | |||
| JP2010280946A | 2010-12-16 |
Other References:
See also references of EP 4039855A4
Attorney, Agent or Firm:
AOYAMA, Masakazu (JP)
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