Title:
THERMAL BARRIER FILM
Document Type and Number:
WIPO Patent Application WO/2021/199894
Kind Code:
A1
Abstract:
[Problem] To provide a thermal barrier film which exhibits high transparency, excellent friction resistance, excellent film strength and excellent bendability, while having high thermal barrier properties. [Solution] A thermal barrier film which comprises a thermal barrier layer that is superposed on at least one surface of a base material film directly or with another layer being interposed therebetween, wherein: the thermal barrier layer is formed from a thermal barrier layer forming composition that contains an antimony-doped tin oxide and a binder resin; the average primary particle diameter of the antimony-doped tin oxide contained in the thermal barrier layer is less than 50 nm; the minimum diameter of the mandrel at which a crack occurs in the thermal barrier layer is less than 4 mm as determined by a cylindrical mandrel method; the spectral transmittance T1400 nm of the thermal barrier film at the wavelength of 1,400 nm is 20% or less; and the haze value of the thermal barrier film is 8% or less.
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Inventors:
SHIGENO KENTO (JP)
TATAMI NAKA (JP)
SAWASAKI SHINJI (JP)
TATAMI NAKA (JP)
SAWASAKI SHINJI (JP)
Application Number:
PCT/JP2021/008483
Publication Date:
October 07, 2021
Filing Date:
March 04, 2021
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
B32B27/18; A01G9/14; A01G9/22; A01G9/24; A01G13/02; B32B27/36
Domestic Patent References:
| WO2014010562A1 | 2014-01-16 |
Foreign References:
| JP2015212736A | 2015-11-26 | |||
| JP2018106153A | 2018-07-05 | |||
| JP2014240907A | 2014-12-25 | |||
| JP2008528313A | 2008-07-31 |
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