Title:
THERMAL EXPANSION RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2014/057689
Kind Code:
A1
Abstract:
[Problem] To provide a thermal expansion resin composition which gives molded bodies having excellent fire resistance and stress at break, and relatively low elasticity. [Solution] This thermal expansion resin composition contains an epoxy resin, a thermally expandable graphite, and an inorganic filler. The epoxy resin contains a bisphenol-type epoxy compound and an aliphatic epoxy compound, wherein the weight ratio of the bisphenol-type epoxy compound to the aliphatic epoxy compound is in the range 95:5-60:40. This thermal expansion resin composition can be applied in refractory coating materials for pillars, beams and walls, in fireproofsashes, in fireproof compartment passage structures, in fireproof doors, etc.
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Inventors:
YOSHITAKE TOSHITAKA (JP)
TONO MASAKI (JP)
OTSUKA KENJI (JP)
YANO HIDEAKI (JP)
TONO MASAKI (JP)
OTSUKA KENJI (JP)
YANO HIDEAKI (JP)
Application Number:
PCT/JP2013/006071
Publication Date:
April 17, 2014
Filing Date:
October 10, 2013
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08L63/00; C08G59/20; C08K3/00; C08K3/04
Foreign References:
| JP2006213786A | 2006-08-17 | |||
| JP2011074214A | 2011-04-14 | |||
| JP2006348229A | 2006-12-28 | |||
| JP2002012678A | 2002-01-15 | |||
| JP2003064209A | 2003-03-05 | |||
| JP2007146169A | 2007-06-14 | |||
| JP2000239492A | 2000-09-05 | |||
| JPH11116776A | 1999-04-27 | |||
| JP2000143941A | 2000-05-26 | |||
| JP2011042715A | 2011-03-03 | |||
| JP2003147052A | 2003-05-21 | |||
| JP2008506803A | 2008-03-06 | |||
| JP2000143941A | 2000-05-26 |
Other References:
See also references of EP 2907847A4
Attorney, Agent or Firm:
HIRANO, YASUHIRO (JP)
Yasuhiro Hirano (JP)
Yasuhiro Hirano (JP)
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