Title:
THERMAL SENSOR AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
WIPO Patent Application WO/2003/060434
Kind Code:
A1
Abstract:
A thermal sensor in which heaters (2) arranged on the surface of a planar substrate (1) of 150μm thick or above and wiring (3) required for output signal are connected electrically with through wiring (4) formed from the surface to the rear surface of the substrate (3) and further connected electrically with an I&sol O wiring part (12) formed on the rear surface of the substrate. Since the I&sol O part which must be separated sufficiently from the detecting part on the surface of the substrate in prior art can be formed on the rear surface of the substrate and can be arranged freely with respect to the detecting part, size of the element can be reduced and the manufacturing cost can be reduced.
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Inventors:
YUTANI NAOKI (JP)
MATSUURA TSUKASA (JP)
TSUTSUMI KAZUHIKO (JP)
MATSUURA TSUKASA (JP)
TSUTSUMI KAZUHIKO (JP)
Application Number:
PCT/JP2002/000043
Publication Date:
July 24, 2003
Filing Date:
January 09, 2002
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
YUTANI NAOKI (JP)
MATSUURA TSUKASA (JP)
TSUTSUMI KAZUHIKO (JP)
YUTANI NAOKI (JP)
MATSUURA TSUKASA (JP)
TSUTSUMI KAZUHIKO (JP)
International Classes:
G01F1/684; G01F1/692; (IPC1-7): G01F1/692
Foreign References:
| JPH11281445A | 1999-10-15 | |||
| JPS63208717A | 1988-08-30 | |||
| JPS643517A | 1989-01-09 | |||
| JPS6239722A | 1987-02-20 |
Attorney, Agent or Firm:
Miyata, Kaneo c/o Mitsubishi Denki Kabushiki Kaisha 2-3 (Marunouchi 2-Chome Chiyoda-ku, Tokyo, JP)
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