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Title:
THERMAL TRANSFER SHEET
Document Type and Number:
WIPO Patent Application WO/2010/035354
Kind Code:
A1
Abstract:
Disclosed is a thermal transfer sheet which has good heat resistance and slipping properties, which does not cause tailing upon printing, and which can exhibit good printing performance in high speed printing. Specifically disclosed is a thermal transfer sheet comprising: a base; a color material layer arranged on one surface of the base; and a heat-resistant slipping layer arranged on the other surface of the base, wherein the heat-resistant slipping layer comprises a polyamide resin, a silicone-modified polyamide resin and an ethoxylated alcohol-modified wax.

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Inventors:
IWAOKA SAKIE (JP)
YONEYAMA YASUSHI (JP)
FUKUI DAISUKE (JP)
Application Number:
PCT/JP2008/072692
Publication Date:
April 01, 2010
Filing Date:
December 12, 2008
Export Citation:
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Assignee:
DAINIPPON PRINTING CO LTD (JP)
IWAOKA SAKIE (JP)
YONEYAMA YASUSHI (JP)
FUKUI DAISUKE (JP)
International Classes:
B41M5/382; B41M5/40
Foreign References:
JPH05229271A1993-09-07
JPH10324070A1998-12-08
JP2001162934A2001-06-19
JP2001334760A2001-12-04
JPH06114983A1994-04-26
JP2001334760A2001-12-04
JPH07314929A1995-12-05
JPH07149062A1995-06-13
JP2003300388A2003-10-21
Other References:
See also references of EP 2327559A4
Attorney, Agent or Firm:
YASUTOMI, Yasuo et al. (JP)
Yasuo Yasutomi (JP)
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