Title:
THERMOPILE SENSOR
Document Type and Number:
WIPO Patent Application WO/2022/030039
Kind Code:
A1
Abstract:
This thermopile sensor comprises a substrate, a cavity area, a thin-film part, a sensor part, and a circuit part. The sensor part comprises two or more thermopiles that are arranged side by side and each comprises a plurality of thermocouples arranged on the thin-film part in parallel at a prescribed interval. Each thermocouple comprises a hot junction formed on the end closer to the adjacent thermopile and a cold junction formed on the end further from the adjacent thermopile. The hot junctions are positioned over the cavity area and the cold junctions are positioned over an area of the substrate other than the cavity area. The circuit part, the cold junctions, and portions of the areas of the thermopiles that are on the sides of the cold junctions and overlap with the cavity area in a plan view are covered with a metallic protective film.
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Inventors:
KASAI TAKASHI (JP)
Application Number:
PCT/JP2021/007659
Publication Date:
February 10, 2022
Filing Date:
March 01, 2021
Export Citation:
Assignee:
MMI SEMICONDUCTOR CO LTD (JP)
International Classes:
G01F1/684; G01F1/692
Foreign References:
| JPH02205730A | 1990-08-15 | |||
| JP2006214758A | 2006-08-17 | |||
| JP2013180345A | 2013-09-12 | |||
| JP2001091360A | 2001-04-06 | |||
| JP2002156283A | 2002-05-31 | |||
| US20160282194A1 | 2016-09-29 |
Attorney, Agent or Firm:
IP FIRM SHUWA (JP)
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