Title:
THERMOPLASTIC RESIN, RESIN COMPOSITION, AND MOLDING OF HIGH THERMAL CONDUCTIVITY
Document Type and Number:
WIPO Patent Application WO/2012/108412
Kind Code:
A1
Abstract:
The thermoplastic resin is characterized in being obtained from: (A) 25 - 60 mole% of biphenyl group-containing units; (B) 25 - 60 mole% of straight chain units (such as straight chain aliphatic hydrocarbon chains); and (C) 1 - 25 mole% of units with substituents selected from the group consisting of uncondensed aromatic groups, condensed aromatic groups, heterocyclic groups, alicyclic groups and alicyclic heterocyclic groups that have the effect of folding the main chain.
Inventors:
NAKAMURA MITSURU
YOSHIHARA SHUSUKE
YOSHIHARA SHUSUKE
Application Number:
PCT/JP2012/052700
Publication Date:
August 16, 2012
Filing Date:
February 07, 2012
Export Citation:
Assignee:
KANEKA CORP (JP)
NAKAMURA MITSURU
YOSHIHARA SHUSUKE
NAKAMURA MITSURU
YOSHIHARA SHUSUKE
International Classes:
C08G63/193; C08G69/44; C08K3/00; C08L67/00; C08L77/12
Domestic Patent References:
| WO2010050202A1 | 2010-05-06 |
Foreign References:
| JPH0317121A | 1991-01-25 | |||
| JP2011231157A | 2011-11-17 | |||
| JP2010195927A | 2010-09-09 | |||
| JP2003266431A | 2003-09-24 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
Patent business corporation Hara [Kenzo] international patent firm (JP)
Patent business corporation Hara [Kenzo] international patent firm (JP)
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