Title:
THIN-FILM CAPACITOR AND ELECTRONIC CIRCUIT BOARD HAVING SAME
Document Type and Number:
WIPO Patent Application WO/2022/004015
Kind Code:
A1
Abstract:
[Problem] To provide a thin-film capacitor which is less likely to warp. [Solution] A thin-film capacitor 1 is provided with: a metal foil 10 having an upper surface 11 and a lower surface 12 which are roughened; a dielectric film D covering the upper surface 11 of the metal foil 10 and having an opening portion exposing the metal foil 10 partly; a dielectric film E covering the lower surface 12 of the metal foil and composed of a dielectric material having a coefficient of thermal expansion smaller than that of the metal foil 10; a first electrode layer contacting the metal foil via the opening portion; and a second electrode layer contacting the first dielectric film without contacting the metal foil. Thus, the lower surface 12 of the metal foil 10 is covered with the dielectric film E having a smaller coefficient of thermal expansion, making it possible to suppress development of warping.
Inventors:
ISHII DAIKI (JP)
YANO YOSHIHIKO (JP)
YAMASHITA YUKI (JP)
YOSHIDA KENICHI (JP)
TAKAHASHI TETSUHIRO (JP)
YANO YOSHIHIKO (JP)
YAMASHITA YUKI (JP)
YOSHIDA KENICHI (JP)
TAKAHASHI TETSUHIRO (JP)
Application Number:
PCT/JP2020/048391
Publication Date:
January 06, 2022
Filing Date:
December 24, 2020
Export Citation:
Assignee:
TDK CORP (JP)
International Classes:
H01G4/33; H01G9/048; H01G9/052
Domestic Patent References:
| WO2017026233A1 | 2017-02-16 | |||
| WO2007010768A1 | 2007-01-25 |
Foreign References:
| JP2009246110A | 2009-10-22 | |||
| JPS58153321A | 1983-09-12 | |||
| JP2007149730A | 2007-06-14 | |||
| JP2001203455A | 2001-07-27 | |||
| JP2008078299A | 2008-04-03 |
Attorney, Agent or Firm:
WASHIZU Mitsuhiro et al. (JP)
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