Title:
THIN FILM CAPACITOR AND ELECTRONIC CIRCUIT BOARD COMPRISING SAID THIN FILM CAPACITOR
Document Type and Number:
WIPO Patent Application WO/2022/004016
Kind Code:
A1
Abstract:
[Problem] Provide a thin film capacitor with high adhesion to a circuit board. [Solution] This thin film capacitor 1 comprises: a metal foil 10 in which a top surface 11 is roughened; a dielectric film D that covers the top surface 11 of the metal foil 10, and has an opening that partially exposes the metal foil 10; a first electrode layer that is in contact with the metal foil 10 via the opening; and a second electrode layer that is in contact with the dielectric film D without being in contact with the metal foil 10. The first and second electrode layers are formed in a region surrounded by an outer peripheral region 15 without covering the outer peripheral region 15 of the top surface 11 of the metal foil 10. In this way, since the outer peripheral region 15 of the roughened top surface 11 of the metal foil 10 is exposed, adhesion with the circuit board is improved.
Inventors:
ISHII DAIKI (JP)
YANO YOSHIHIKO (JP)
YAMASHITA YUKI (JP)
YOSHIDA KENICHI (JP)
TAKAHASHI TETSUHIRO (JP)
YANO YOSHIHIKO (JP)
YAMASHITA YUKI (JP)
YOSHIDA KENICHI (JP)
TAKAHASHI TETSUHIRO (JP)
Application Number:
PCT/JP2020/048392
Publication Date:
January 06, 2022
Filing Date:
December 24, 2020
Export Citation:
Assignee:
TDK CORP (JP)
International Classes:
H01G4/33; H01G9/048; H01G9/055
Domestic Patent References:
| WO2017026233A1 | 2017-02-16 | |||
| WO2007010768A1 | 2007-01-25 |
Foreign References:
| JP2009246110A | 2009-10-22 | |||
| JP2007149730A | 2007-06-14 | |||
| JP2001203455A | 2001-07-27 | |||
| JP2008078299A | 2008-04-03 |
Attorney, Agent or Firm:
WASHIZU Mitsuhiro et al. (JP)
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