Title:
THIN FILM CAPACITOR, PRODUCTION METHOD THEREFOR, AND ELECTRONIC CIRCUIT BOARD EQUIPPED WITH THIN FILM CAPACITOR
Document Type and Number:
WIPO Patent Application WO/2022/004017
Kind Code:
A1
Abstract:
[Problem] To provide a thin film capacitor in which short circuit faults are unlikely to occur. [Solution] A thin film capacitor 1 comprises: a metal foil 10 that has a roughened top surface 11; a dielectric film D that covers the top surface 11 of the metal foil 10 and has an opening for partially exposing the metal foil 10; a first electrode layer that is in contact with the metal foil 10 via the opening; a second electrode layer that is in contact with the dielectric film D without being in contact with the metal foil 10; and an insulating member 21 that separates the first electrode layer and the second electrode layer. The cross-section of the insulating member 21 has a tapered shape. Thus, it is possible to dispose both the first and second electrode layers on the top surface 11 of the metal foil 10. Furthermore, since the cross-section of the insulating member 21 has a tapered shape, adhesion of the insulating member 21 is increased, making it possible to prevent short-circuiting of the first electrode layer and the second electrode layer.
Inventors:
ISHII DAIKI (JP)
YANO YOSHIHIKO (JP)
YAMASHITA YUKI (JP)
YOSHIDA KENICHI (JP)
TAKAHASHI TETSUHIRO (JP)
YANO YOSHIHIKO (JP)
YAMASHITA YUKI (JP)
YOSHIDA KENICHI (JP)
TAKAHASHI TETSUHIRO (JP)
Application Number:
PCT/JP2020/048393
Publication Date:
January 06, 2022
Filing Date:
December 24, 2020
Export Citation:
Assignee:
TDK CORP (JP)
International Classes:
H01G4/33; H01G9/048; H01G9/055
Domestic Patent References:
| WO2017026233A1 | 2017-02-16 | |||
| WO2007010768A1 | 2007-01-25 |
Foreign References:
| JP2009246110A | 2009-10-22 | |||
| JP2017130653A | 2017-07-27 | |||
| JP2007149730A | 2007-06-14 | |||
| JP2001203455A | 2001-07-27 | |||
| JP2008078299A | 2008-04-03 |
Attorney, Agent or Firm:
WASHIZU Mitsuhiro et al. (JP)
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