Title:
THIN FILM CAPACITOR AND ELECTRONIC CIRCUIT BOARD PROVIDED WITH SAME
Document Type and Number:
WIPO Patent Application WO/2022/004019
Kind Code:
A1
Abstract:
[Problem] To provide a thin film capacitor having high adhesiveness with respect to a multilayer substrate. [Solution] A thin film capacitor 1 comprises: a metal foil 10, the upper surface 11 of which has been roughened; a dielectric film D which covers the upper surface 11 of the metal foil 10 and which has an opening that partially exposes the metal foil 10; a first electrode layer which is in contact with the metal foil 10 via the opening; and a second electrode layer which is in contact with the dielectric film D without being in contact with the metal foil 10. The height H2 of the first electrode layer is less than the height of the second electrode layer H1. Thus, adhesiveness when embedded in a multilayer substrate is increased, and ESR properties are improved.
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Inventors:
YANO YOSHIHIKO (JP)
ISHII DAIKI (JP)
YOSHIDA KENICHI (JP)
YAMASHITA YUKI (JP)
ISHII DAIKI (JP)
YOSHIDA KENICHI (JP)
YAMASHITA YUKI (JP)
Application Number:
PCT/JP2020/048395
Publication Date:
January 06, 2022
Filing Date:
December 24, 2020
Export Citation:
Assignee:
TDK CORP (JP)
International Classes:
H01G4/33; H01G9/048; H01G9/055
Domestic Patent References:
| WO2017026233A1 | 2017-02-16 | |||
| WO2008149622A1 | 2008-12-11 | |||
| WO2007010768A1 | 2007-01-25 |
Foreign References:
| JP2009246110A | 2009-10-22 | |||
| JP2007149730A | 2007-06-14 | |||
| JP2001203455A | 2001-07-27 | |||
| JP2008078299A | 2008-04-03 |
Attorney, Agent or Firm:
WASHIZU Mitsuhiro et al. (JP)
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